Aluminum PCB
Metal-core boards that use an aluminum base plate to move heat away from components, common in LED lighting and power conversion.
Each board family below is a distinct manufacturing process. Capability is recorded per product series, so a factory that advertises a high layer count on one line is not automatically credited with it on another.
Metal-core boards that use an aluminum base plate to move heat away from components, common in LED lighting and power conversion.
Circuits built on flexible polyimide film that can be bent or folded, used where a rigid board or a cable harness will not fit.
High density interconnect boards built with build-up dielectric, laser-drilled microvias and fine lines instead of only mechanically drilled through vias.
Boards built on low-loss RF laminates where dielectric constant, dissipation factor and impedance consistency drive performance.
Three or more copper layers bonded into one board, used where routing density and controlled impedance make double-sided construction impractical.
A board combining rigid sections and flexible sections in one laminated assembly, removing the connectors between the two.
Looking for layer count, line width, drill size or impedance instead? That is a capability filter, not a board type. The two sections are kept separate on purpose so the same keyword is not chased by two pages.